1- SMI – Diamond ID Slicing Blades:
Semiconductor Materials, Inc (SMI), Patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials.
SMI uses only, 100% Natural virgin diamonds in 100% concentration and distribution. Pure stress-free Electroplated nickel, using only the highest reagent graded chemicals are used.
All SMI I.D. slicing blades (except MARK VIII) are manufactured with our Patented multiple layer diamond rim under U.S. Patents 3205624, 3488892, 3640027 and other corresponding foreign Patents.
2- SMI- Diamond Edge Grinding Wheels:
SMI’s Multi-layer Virgin diamond Edge Grinding Wheels, are 100% pure electronically nickel-plated in 100% concentration and distribution. We manufacture only the highest quality Edge Grinding Wheels for semiconductor wafers. We offer the widest range of sizes and shapes to meet all customer’s specifications and applications.
Available Sizes and Grooves: SMI manufactures many different Types of Stainless Steel or Aluminum cores in O. D. = 1 ½”, 2”, 4”, 6”, 8”.
The most common Edge Grinding Wheel contour is the R type (Radius) followed by the F type (Flat w/2 Radius). SMI is able to place up to 9 grooves of these shapes on its 6” and 8” single grit diamond wheels, and up to 8 grooves on its dual grit diamond wheels.
3- SMI- Diamond Band Saw Blade:
SMI’s Diamond Band saw Blade are use a wide variety of materials ranging from hard Sapphire to the soft Silicon. 100% pure electronically nickel-plated in 100% concentration and distribution, for longer life.
Our high speed Core Materials offer increase stability and life. The electroplated diamond rim is offered in many grit sizes and kerf thickness’.
Whether cutting silicon, quartz, glass, stone, ceramics or sapphire, SMI will specially design a band saw that will meet your special need.
**many other sizes available upon request**
4- SMI- Diamond Core Drills:
SMI’s diamond Core Drills are custom manufactured to customer specification.
SMI’s Metal Bond and Electroplated Diamond Core Drills are developed for high strength and longevity in a wide variety of materials ranging from hard Sapphire to the soft Silicon.
SMI’s specially formulated Metallic Bonding or pure electronically nickel-plated in 100% concentration and distribution results in longer life.
Our high speed Core Materials offer increase stability and life. Whether cutting silicon, quartz, glass, stone, ceramics or sapphire, SMI will specially design a band saw that will meet your special need. ** SMI offer in Resin bond on request.**
5- SMI- Diamond Cup Wheels:
SMI’s diamond Cup Wheels are custom manufactured to customer specification.
SMI’s Metal Bond and Electroplated Diamond Cup Wheels are developed for high strength and longevity in a wide variety of materials ranging from hard Sapphire to the soft Silicon.
SMI’s specially formulated Metallic Bonding or pure electronically nickel-plated in 100% concentration and distribution results in longer life.
Our high speed Core Materials offer increase stability and life. Whether grinding and shaping silicon, quartz, glass, stone, ceramics or sapphire, SMI will specially design a cup wheels that will meet your special need.
** SMI offers in wide variety of shapes and sizes on request.**
6- SMI- O.D. Cropping Blade:
Cropping Saw: Available in “segmented” and “continuous” diamond rim. Metal or Resin bonding. Standard Sizes 6”, 8”,10”12”, 14”, 16”, 18” and 20”.
Dry/Wet Cement and Masonry Saw: Supreme quality saw blades for “cured” or “green” concrete. Block or Asphalt. Standard Sizes 6”, 8”, 10”, 12”, 14”, 16”, 18, 20” 24” 26” 30”
Plated Band Saw Blades: 100% Nickel-electroplated diamond cropping saw blades. Available in various diamond grits to suit all production needs. All standard lengths and widths.
**Many other sizes available upon request**
7- SMI- Wire Diamond:
Sawing Wire is a high grade steel wire that can be used to cut a wide range of products; Cropping, Squaring and Slicing. The technique finds its origin of the world of solar cells, this technology was developed to decrease kerf loss and increase productivity. This led to a breakthrough in cost effective production of wafers. This technique was also offering productivity advantages for existing wafer diameters and the capability for slicing larger (300mm and above) wafer diameters. Other industries cutting hard and brittle materials are also taking advantage of this sawing technique.
8- Dressing Stick:
SMI provide Dressing stones specially formulated for cleaning and truing and dressing of the diamond.
Truing, cleaning and dressing diamond, CBN, and conventional abrasive wheels.
Abrasive grain: Aluminum Oxide (A/O white) , Silicon Carbide (S/C Black or Green)
Selecting the appropriate dressing stick for each application depends on the wheel size, type, speed,
specification and grit size, as well as the work piece material.
**Many sizes, grits and hardness’ available upon request**
