Expert knowledge and vast experience in the ID slicing process
In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era.
Patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximise wafer yields.
DIAMOND The diamonds used in the manufacture of SMI diamond grinding wheels can be classified into two categories: natural diamond and synthetic diamonds. Every since synthetic diamonds were first introduced
Specifically designed and manufactured to maximise wafer yields in all types of semiconductor materials.
Semiconductor Materials, Inc(SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI I.D. Blade and its
What We Do
ID DIAMOND SAW BLADES:
SMI uses only, 100% Natural virgin diamonds in 100% concentration and distribution. Pure stress-free Electroplated nickel, using only the highest reagent graded chemicals are used. All SMI I.D. slicing blades
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Band Saw Blade
SMI- Diamond Band Saw Blade: SMI's Diamond Band saw Blade are use a wide variety of materials ranging from hard Sapphire to the soft Silicon. 100% pure electronically nickel-plated in
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Edge Grinding Wheels
SMI- Diamond Edge Grinding Wheels: SMI's Multi-layer Virgin diamond Edge Grinding Wheels, are 100% pure electronically nickel-plated in 100% concentration and distribution. We manufacture only the highest quality Edge Grinding
Learn MoreOUR MAIN PRODUCTS
ID Diamond Slicing Blades • Edge Grinding Wheels • O.D. Diamond Wheels (Bonded/Resin/Plated) • Diamond Tools and Products • Cut-Off Wheels • Band Saw • Core Drills • Dressing Stones
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Expert knowledge and vast experience in the ID slicing process
In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc.
Patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximise wafer yields.
DIAMOND The diamonds used in the manufacture of SMI diamond grinding wheels can be classified into two categories: natural diamond
Specifically designed and manufactured to maximise wafer yields in all types of semiconductor materials.
Semiconductor Materials, Inc(SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all
SMI diamond grinding wheels
The diamonds used in the manufacture of SMI diamond grinding wheels can be classified into two categories: natural diamond and