In the spring of 1963, John A. Boujikian, inventor of the inside diameter (I.D.) slicing blade founded Semiconductor Materials, Inc. (SMI). His development was the start of large-scale microchip era. With over 45 years experience, SMI is the leading manufacturer of ID slicing blades and edge grinding wheels for all types of semi-conductor materials and Read More
Patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximise wafer yields.
DIAMOND The diamonds used in the manufacture of SMI diamond grinding wheels can be classified into two categories: natural diamond and synthetic diamonds. Every since synthetic diamonds were first introduced in 1957. Their applications have been steadily increasing.Now they are acceptedas the principal material for diamond grinding wheels. Two important achievements in the history of Read More
Specifically designed and manufactured to maximise wafer yields in all types of semiconductor materials.
Semiconductor Materials, Inc(SMI), patented multi-layered diamond I.D. slicing blades are specifically designed and manufactured to maximize wafer yields in all types of semiconductor materials. The SMI I.D. Blade and its high speed, creep resistant core materials is specifically manufactured to all higher tension, minimizing blade bow, saw marks and exit chipping